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Place of Origin : Guangdong, China
Brand Name : mankun
MOQ : 500 Sheets
Price : Negotiation
Payment Terms : Negotiation
Supply Ability : 20000PCs per month
Delivery Time : 5-15 work days
Packaging Details : customized packaging
Lighting solutions service : Lighting and circuitry design
Product Name : Letter Decoration lamp
Power : 7W,9W,10W,12W
Application : Outdoor Decoration
Color : Picture
Type : Electronic Board
Chip material : SMD2835
Product name : Guangzhou Aluminum LED PCB board
PRODUCT DESCRIPTION
1. Blank PCB manufacturing from 1 to 32 layers;
2. LED PCB circuit Custom;
3. LED PCB Clone;
4. Component sourcing;
5. LED PCB Assembly;
6. Custom development program;
7. PCB/ PCBA Test.
QUOTATION NEEDS:
1. PCB dimension
2. PCB material :alumium / fr4 (layers)
3.Soldermask color& silkscreen color
4. PCB thickness(1/1.2/1.6/2mm)
5.PCB copper (1oz 2oz 3oz)
6. LED Brand&LED Model
7.Watt&Voltage&Current
8.Led board function&Application
9.Order quantity
10.Your logo
TECHNICIAL CAPABILITY:
Item | Technical Specification | ||
Standard | Advanced | ||
Number of Layers | 1-48 layer | 48-60 layer | |
Laminate | CEM-3,FR4 (High Tg, Halogen Free),Rogers,Teflon, Arlon, Metal Base (Aluminum, Copper), Mixematerial. | Thermount | |
Laminate Brand | KB,Shengyi,Nanya,Isola,Goword,grace,Rogers, Arlon,Taconic,Ventec,Boyu | customer specify | |
Maximum board size | 610X915mm | 610x1060mm | |
Board thickness | 0.15-4.5mm | 0.13-6.0mm | |
Minimum line width | 4mils (1oz Cu finished) | 3mils(1oz Cu finished) | |
Minimum Line gap | 4mils(1oz Cu finished) | 3mils(1oz Cu finished) | |
Outer layer copper thickness | 1/3-12OZ | 12-16OZ | |
Inner layer copper thickness | 1/3-14OZ | 14-16OZ | |
Min. finished hole size (Mechanical) | 0.20mm | 0.15mm | |
Min. finished hole size (laser hole) | 0.075mm | 0.05mm | |
Aspect ratio | 10:01 | 12:1 | |
Solder Mask Types and brand | Nanya,Taiyo | customer specify | |
Solder Mask Color | Gloss & matte green | Red, Black, Yellow, Blue,white | |
Impedance Control Tolerance | 10% | 5% | |
Surface Treatment | Flash Gold | Au:1-3U'' | Au: 3U'' |
Immersion Gold | Au:2-4U'' | Au: 2-6U'' | |
Sn/PB HASL | Sn:100-1000U'' | Sn: 200-800U'' | |
Leadfree HASL | Sn:100-1000U'' | Sn: 200-800U'' | |
Immersion Silver | Ag: 0.15um-0.75um | / | |
OSP (Entek) | Thicknes: 0.20-0.50um | / | |
Hard Gold Finger | Au: 30U'' | Au:30-60U'' | |
Hard Gold Plating | Au-30U'' | Au:30-60U'' | |
Carbon ink | |||
Immsion Sn | Sn:0.8-1.2um | ||
V-Cut | V-cut degree | 30+/-5 degree | 20,45, 60 Degree |
Tol: +/-0.13mm | Tol: +/-0.10mm | ||
Chamfer | The angle type of the chamfer | 20,30, 45 Degree | / |
Plug via hole | Min. size can be plugged | 0.15mm | / |
Max. size can be plugged | 0.50mm | 0.70mm | |
Min. distance between the IC pads can keep SM bridge | 8mils | 7mils | |
Min. SM bridge for green soldermask | 4 mils | 3 mils | |
Min. SM bridge for black soldermask | 5mils | 4mils |
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